منابع مشابه
LEAD-FREE BNKT PIEZOELECTRIC ACTUATOR
An actuator is a device that converts input energy into mechanical energy. According to various types of input energy, various actuators have been advanced. Displacement in the electromagnetic, hydraulic and pneumatic actuators achieve by moving a piston via electromagnetic force or pressure, however the piezoelectric actuator (piezoceramic plates) displace directly. Therefore, accuracy and spe...
متن کاملLead-free Solder Assembly
Until non-lead solder conversion is mature, the evaluation of materials and components is likely to identify trade-offs. The performance of the no-clean andwater-soluble solder pastes that were tested varied widely. Ultimately each company will need to determine which attributes are most important for their product line. Also components needed for a product may not be currently available as lea...
متن کاملLead-free multilayer piezoelectric transformer.
In this article, a multilayer piezoelectric transformer based on lead-free Mn-doped 0.94(Bi(12)Na(12))TiO(3)-0.06BaTiO(3) ceramics is presented. This piezoelectric transformer, with a multilayered construction in the thickness direction, is 8.3 mm long, 8.3 mm wide, and 2.3 mm thick. It operates in the second thickness extensional vibration mode. For a temperature rise of 20 degrees C, the tran...
متن کاملLead-free acoustic emission sensors.
Acoustic emission (AE) sensors have been fabricated using both soft- and hard-type lead-free (Na0.5K0.5)NbO3-based ceramics. The acoustic and electromechanical properties of the ceramics have been determined using the resonance technique. The lead-free AE sensors were calibrated using a laser source and compared to a commercial sensor. A lead zirconate titanate (PZT) 5H ceramics AE sensor has a...
متن کاملConventional Tin-Lead and RoHS-Compliant Lead-Free Components
1 While lead-frame and wire-bond packages can be provided as eutectic or lead-free, currently Altera flip-chip packages are RoHS compliant. We use Exemption #15 for the first Level Connections between the flip-chip die to the substrate (RoHS Exemption #15: Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within the integrated circuit flip-...
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ژورنال
عنوان ژورنال: III-Vs Review
سال: 2004
ISSN: 0961-1290
DOI: 10.1016/s0961-1290(04)00474-0